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TN-MSP210S-RFD
TN
TN-MSP210S-RFD desktop dual-target magnetron sputtering coater. The equipment has been miniaturized, while retaining the high-vacuum stainless steel cavity, while simplifying other mechanisms, limiting the shape of the equipment to the desktop level, greatly reducing the installation site requirements. The equipment is equipped with a DC power supply and an RF power supply. The DC target can be used for sputtering of metals and other conductive materials. The RF power supply can be used for sputtering of various non-metals and metal oxides. The equipment vacuum system adopts all imported vacuum pumps, with fast pumping speed, high ultimate vacuum and excellent vacuum performance. The equipment has compact structure, perfect functions and easy to use. It is very suitable for various coating tests.
This device can be used for preparing single-layer or multi-layer ferroelectric thin films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, and the like. Compared with similar equipment, this three-target magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing material films in a laboratory
Desktop type double target magnetron sputtering coater Technical Parameters:
Desktop type double target magnetron sputtering coater | ||||
Sample stage
| size | φ150mm | heating | Up to 500℃ |
Rotating speed | 0-20 adjustable | |||
Magnetron sputtering target | Quantity | 2” x2 dual targets share a baffle | ||
Vacuum chamber | Cavity size | φ210mm X 230mm | Observation window | φ40mm |
Cavity material | SS304 stainless steel | Opening method | Front door | |
TN-MSP210S-RFD desktop dual-target magnetron sputtering coater. The equipment has been miniaturized, while retaining the high-vacuum stainless steel cavity, while simplifying other mechanisms, limiting the shape of the equipment to the desktop level, greatly reducing the installation site requirements. The equipment is equipped with a DC power supply and an RF power supply. The DC target can be used for sputtering of metals and other conductive materials. The RF power supply can be used for sputtering of various non-metals and metal oxides. The equipment vacuum system adopts all imported vacuum pumps, with fast pumping speed, high ultimate vacuum and excellent vacuum performance. The equipment has compact structure, perfect functions and easy to use. It is very suitable for various coating tests.
This device can be used for preparing single-layer or multi-layer ferroelectric thin films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, and the like. Compared with similar equipment, this three-target magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing material films in a laboratory
Desktop type double target magnetron sputtering coater Technical Parameters:
Desktop type double target magnetron sputtering coater | ||||
Sample stage
| size | φ150mm | heating | Up to 500℃ |
Rotating speed | 0-20 adjustable | |||
Magnetron sputtering target | Quantity | 2” x2 dual targets share a baffle | ||
Vacuum chamber | Cavity size | φ210mm X 230mm | Observation window | φ40mm |
Cavity material | SS304 stainless steel | Opening method | Front door | |
