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TN-MSP500S-2DC-1RF
TN
Three target magnetron sputtering coating instrument is a cost-effective magnetron sputtering coating equipment independently developed by our company, which has the characteristics of standardization, modularization and customization. The equipment can be used to prepare single-layer or multi-layer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, polytetrafluoroethylene films, etc. DC power supply can be used for the preparation of metal films, RF power supply can be used for the preparation of non-metallic films, and the three targets can meet the needs of multi-layer or multiple coating. Compared with similar equipment, the three-target magnetron sputtering coating instrument is not only widely used, but also has the advantages of small volume and easy operation. It is an ideal equipment for preparing material films in the laboratory.
magnetron sputtering coater technical parameters :
Three target magnetron sputtering coater machine (DC power supply + RF power supply) | ||
Sample table | Sputtering mode | Sputtering orientation upwards, the sample stage is located above the sputtering target； Center top setting sample holder, with one shutter |
Sample holder | φ150mm | |
Control accuracy | ±1℃ | |
Heating range | Room temperature～500℃ | |
Adjustable speed | 1-20rpm adjustable | |
Target base distance adjustable | The distance between the target and the substrate can be adjusted electrically | |
Magnetron target gun | Target plane | Circular plane target |
Sputtering vacuum | 10Pa～0.2Pa | |
Target diameter | 50～50.8mm | |
Target thickness | 2～5mm Note: if the target is magnetic material (such as Fe, Co, Ni), the thickness cannot be more than 1.5mm, and strong magnetic sputtering gun is required, will need extra charge. | |
Insulation voltage | >2000V | |
Quantity | 2 inches*3；with shutters for each gun | |
Cable specification | SL-16 | |
Target head temperature | ≦65℃ | |
Vacuum chamber | Inner wall treatment | Electrolytic polishing |
Chamber size | φ300mm × 350mm | |
Chamber material | 304 stainless steel | |
Observation window | Quartz window, diameter φ100mm with shutter | |
Sealing method | Viton seal | |
Open method | Top opening, cylinder auxiliary support | |
Gas control system | Flow control | 3-way mass flow meter: Oxygen: range 0～100SCCM Argon gas: range 0～200SCCM Nitrogen: range 0～500SCCM (Note: In order to achieve a higher oxygen-free environment, the vacuum chamber must be cleaned with high-purity inert gas at least 3 times.) |
Gas type | Argon, nitrogen, oxygen, and other inert gases | |
Control valve type | Solenoid valve | |
Control valve static state | Normally closed | |
Measuring linearity | ±1.5% F.S | |
Measurement repeatability | ±0.2% F.S | |
Measuring response time | ≤8 seconds（T95） | |
Working pressure range | 0.3MPa | |
Valve body pressure | 3MPa | |
Working temperature | （5～45）℃ | |
Body material | Stainless steel 316L | |
Valve body leakage rate | 1×10-8Pa.m3/s | |
Pipe joints | 1/4″Compression fitting | |
Input and output signal | 0～5V | |
Power supply | ±15V（±5%）（＋15V 50mA, －15V 200mA） | |
Overall dimensions (mm) | 130 (width) × 102 (height) × 28 (thickness) | |
Communication Interface | RS485 MODBUS protocol | |
DC power supply | Power supply | 500W |
Output voltage | 0～600V | |
Maximum output current | 1A | |
Timing length | 65000 S | |
Starting time | 1～10 S | |
Quantity | 2 sets | |
RF power supply | Power supply | 500W |
Power output range | 0W-500W, with auto match | |
Maximum reflected power | 100W | |
RF frequency | 13.56MHz+/-0.005% stability | |
Power stability | ≤5W | |
Harmonic component | less than -50dbc | |
Quantity | 1 set | |
Three target magnetron sputtering coating instrument is a cost-effective magnetron sputtering coating equipment independently developed by our company, which has the characteristics of standardization, modularization and customization. The equipment can be used to prepare single-layer or multi-layer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, polytetrafluoroethylene films, etc. DC power supply can be used for the preparation of metal films, RF power supply can be used for the preparation of non-metallic films, and the three targets can meet the needs of multi-layer or multiple coating. Compared with similar equipment, the three-target magnetron sputtering coating instrument is not only widely used, but also has the advantages of small volume and easy operation. It is an ideal equipment for preparing material films in the laboratory.
magnetron sputtering coater technical parameters :
Three target magnetron sputtering coater machine (DC power supply + RF power supply) | ||
Sample table | Sputtering mode | Sputtering orientation upwards, the sample stage is located above the sputtering target； Center top setting sample holder, with one shutter |
Sample holder | φ150mm | |
Control accuracy | ±1℃ | |
Heating range | Room temperature～500℃ | |
Adjustable speed | 1-20rpm adjustable | |
Target base distance adjustable | The distance between the target and the substrate can be adjusted electrically | |
Magnetron target gun | Target plane | Circular plane target |
Sputtering vacuum | 10Pa～0.2Pa | |
Target diameter | 50～50.8mm | |
Target thickness | 2～5mm Note: if the target is magnetic material (such as Fe, Co, Ni), the thickness cannot be more than 1.5mm, and strong magnetic sputtering gun is required, will need extra charge. | |
Insulation voltage | >2000V | |
Quantity | 2 inches*3；with shutters for each gun | |
Cable specification | SL-16 | |
Target head temperature | ≦65℃ | |
Vacuum chamber | Inner wall treatment | Electrolytic polishing |
Chamber size | φ300mm × 350mm | |
Chamber material | 304 stainless steel | |
Observation window | Quartz window, diameter φ100mm with shutter | |
Sealing method | Viton seal | |
Open method | Top opening, cylinder auxiliary support | |
Gas control system | Flow control | 3-way mass flow meter: Oxygen: range 0～100SCCM Argon gas: range 0～200SCCM Nitrogen: range 0～500SCCM (Note: In order to achieve a higher oxygen-free environment, the vacuum chamber must be cleaned with high-purity inert gas at least 3 times.) |
Gas type | Argon, nitrogen, oxygen, and other inert gases | |
Control valve type | Solenoid valve | |
Control valve static state | Normally closed | |
Measuring linearity | ±1.5% F.S | |
Measurement repeatability | ±0.2% F.S | |
Measuring response time | ≤8 seconds（T95） | |
Working pressure range | 0.3MPa | |
Valve body pressure | 3MPa | |
Working temperature | （5～45）℃ | |
Body material | Stainless steel 316L | |
Valve body leakage rate | 1×10-8Pa.m3/s | |
Pipe joints | 1/4″Compression fitting | |
Input and output signal | 0～5V | |
Power supply | ±15V（±5%）（＋15V 50mA, －15V 200mA） | |
Overall dimensions (mm) | 130 (width) × 102 (height) × 28 (thickness) | |
Communication Interface | RS485 MODBUS protocol | |
DC power supply | Power supply | 500W |
Output voltage | 0～600V | |
Maximum output current | 1A | |
Timing length | 65000 S | |
Starting time | 1～10 S | |
Quantity | 2 sets | |
RF power supply | Power supply | 500W |
Power output range | 0W-500W, with auto match | |
Maximum reflected power | 100W | |
RF frequency | 13.56MHz+/-0.005% stability | |
Power stability | ≤5W | |
Harmonic component | less than -50dbc | |
Quantity | 1 set | |
