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TN-MSP190S-1T-UD
TN
The desktop bottom-target magnetron sputtering coater utilizes advanced magnetron sputtering technology, allowing for efficient and reliable film deposition. With its user-friendly interface, operators can easily control the deposition parameters and monitor the coating process in real-time.
This coater is capable of depositing films on various substrates, including glass, silicon, and metal. It offers a wide range of deposition materials, such as metals, alloys, and oxides, providing flexibility for different research and industrial applications.
The magnetron sputtering coater ensures excellent film quality, with high adhesion, uniform thickness, and low surface roughness. It enables precise control over film composition and thickness, resulting in consistent and reproducible film properties.
With its compact design, this desktop coater is suitable for laboratories, research institutes, and small-scale production facilities. It requires minimal installation space and can be easily integrated into existing setups.
In summary, the desktop bottom-target magnetron sputtering coater for sensitive film with a stainless steel chamber offers advanced film deposition capabilities, precise control over coating parameters, and excellent film quality. It is an ideal choice for researchers and professionals seeking reliable and efficient thin film deposition solutions.
magnetron sputtering coater Technical Parameters:
Product Name | Desktop bottom-single-target sputtering coater with stainless steel cavity |
Product Model | TN-MSP190S-1T-UD (under) |
Installation Condition | 1,Working environment temperature: 25℃±15℃,humidity: 55%Rh±10%Rh; 2,Equipment power supply:AC220V,50Hz, must be well grounded; 3,Rated power:1000w; 4,Equipment for gas:The equipment chamber should be filled with argon gas for cleaning. The customer should prepare argon gas with purity ≥99.99%. 5,Table size requirements: 600mm×600mm×700mm,bearing capacity ≥ 50kg; 6,The position should be well ventilated and cooled. |
Technical Indicators | 1、 Sputtering power supply:DC power supply 300W;maximum output voltage 600V,limited current output 500mA 2、 Magnetron target:2 inch balance target,magnetic coupling baffle; 3、 Suitable target material: φ50mm x 3mm in thickness 4、 Cavity size :outside diameter194,inside diameter186mm x height 230mm 5、 Cavity material: 304 stainless steel 6、 Rotating heating sample table:rotate speed 1~20rpm continuously adjustable;maximum heating temperature 500℃,the lowest recommended heating rate 10℃/min,the highest recommended heating rate 20℃/min. 7、 Cooling mode :magnetic target and molecular pump require circulating water cooler 8、 Water-cooling machine:the tank volume 9L,flow rate 10L/min 9、 Gas supply system:mass flow meter, type of gas Argon,flow 1~30sccm(customizable) 10、 Accuracy of flow meter :±1.5% measuring range 11、 The air pumping interface of the vacuum chamber is KF25 12、 Air intake interface is 1/4 inch double ferrule joint 13、 Touch screen is 7inch color touch screen 14、 Adjustable sputtering current,sputtering safety current value and safety vacuum value can be set; 15、 safety protection: over current, vacuum is too low automatically cut off the sputtering current 16、 Ultimate vacuum:5E-4Pa(matching molecular pump); 17、 Vacuum measurement is Parana vacuum gauge,the range is:1~105Pa |
Notice | 1,Magnetron sputtering has a high working vacuum, generally within 2Pa, and needs to be used with molecular pump. 2,In order to achieve a high oxygen free environment, the vacuum chamber should be cleaned at least 3 times with high purity inert gas。 3,Magnetron sputtering is sensitive to the air intake, so mass flow meter is needed to control the air intake |
Optional accessory | |
Film thickness Monitor | 1,Film thickness resolution:0.0136Å(aluminum) 2,Accuracy of film thickness :±0.5%,it depends on process conditions, especially sensor position, material stress, temperature and density 3,Measuring speed:100ms-1s/times,measurement range can be set :500000Å(aluminum) 4,Standard sensor crystal:6MHz 5,Suitable for wafer frequency:6MHz suitable for wafer size:Φ14mm mounting flange:CF35 |
Another Accessory | · 1,CY-CZK103 series high performance molecular pump set(including composite vacuum gauge, measuring range 10-5Pa~105Pa) CY-GZK60 series small molecular pump set(including composite vacuum gauge, measuring range 10-5Pa~102Pa) VRD-4 bipolar rotary vane vacuum pump 2,KF25 Vacuum bellows; The length can be 0.5m, 1m or 1.5m. KF40 clamp bracket 3,Film thickness meter crystal oscillator; |
The desktop bottom-target magnetron sputtering coater utilizes advanced magnetron sputtering technology, allowing for efficient and reliable film deposition. With its user-friendly interface, operators can easily control the deposition parameters and monitor the coating process in real-time.
This coater is capable of depositing films on various substrates, including glass, silicon, and metal. It offers a wide range of deposition materials, such as metals, alloys, and oxides, providing flexibility for different research and industrial applications.
The magnetron sputtering coater ensures excellent film quality, with high adhesion, uniform thickness, and low surface roughness. It enables precise control over film composition and thickness, resulting in consistent and reproducible film properties.
With its compact design, this desktop coater is suitable for laboratories, research institutes, and small-scale production facilities. It requires minimal installation space and can be easily integrated into existing setups.
In summary, the desktop bottom-target magnetron sputtering coater for sensitive film with a stainless steel chamber offers advanced film deposition capabilities, precise control over coating parameters, and excellent film quality. It is an ideal choice for researchers and professionals seeking reliable and efficient thin film deposition solutions.
magnetron sputtering coater Technical Parameters:
Product Name | Desktop bottom-single-target sputtering coater with stainless steel cavity |
Product Model | TN-MSP190S-1T-UD (under) |
Installation Condition | 1,Working environment temperature: 25℃±15℃,humidity: 55%Rh±10%Rh; 2,Equipment power supply:AC220V,50Hz, must be well grounded; 3,Rated power:1000w; 4,Equipment for gas:The equipment chamber should be filled with argon gas for cleaning. The customer should prepare argon gas with purity ≥99.99%. 5,Table size requirements: 600mm×600mm×700mm,bearing capacity ≥ 50kg; 6,The position should be well ventilated and cooled. |
Technical Indicators | 1、 Sputtering power supply:DC power supply 300W;maximum output voltage 600V,limited current output 500mA 2、 Magnetron target:2 inch balance target,magnetic coupling baffle; 3、 Suitable target material: φ50mm x 3mm in thickness 4、 Cavity size :outside diameter194,inside diameter186mm x height 230mm 5、 Cavity material: 304 stainless steel 6、 Rotating heating sample table:rotate speed 1~20rpm continuously adjustable;maximum heating temperature 500℃,the lowest recommended heating rate 10℃/min,the highest recommended heating rate 20℃/min. 7、 Cooling mode :magnetic target and molecular pump require circulating water cooler 8、 Water-cooling machine:the tank volume 9L,flow rate 10L/min 9、 Gas supply system:mass flow meter, type of gas Argon,flow 1~30sccm(customizable) 10、 Accuracy of flow meter :±1.5% measuring range 11、 The air pumping interface of the vacuum chamber is KF25 12、 Air intake interface is 1/4 inch double ferrule joint 13、 Touch screen is 7inch color touch screen 14、 Adjustable sputtering current,sputtering safety current value and safety vacuum value can be set; 15、 safety protection: over current, vacuum is too low automatically cut off the sputtering current 16、 Ultimate vacuum:5E-4Pa(matching molecular pump); 17、 Vacuum measurement is Parana vacuum gauge,the range is:1~105Pa |
Notice | 1,Magnetron sputtering has a high working vacuum, generally within 2Pa, and needs to be used with molecular pump. 2,In order to achieve a high oxygen free environment, the vacuum chamber should be cleaned at least 3 times with high purity inert gas。 3,Magnetron sputtering is sensitive to the air intake, so mass flow meter is needed to control the air intake |
Optional accessory | |
Film thickness Monitor | 1,Film thickness resolution:0.0136Å(aluminum) 2,Accuracy of film thickness :±0.5%,it depends on process conditions, especially sensor position, material stress, temperature and density 3,Measuring speed:100ms-1s/times,measurement range can be set :500000Å(aluminum) 4,Standard sensor crystal:6MHz 5,Suitable for wafer frequency:6MHz suitable for wafer size:Φ14mm mounting flange:CF35 |
Another Accessory | · 1,CY-CZK103 series high performance molecular pump set(including composite vacuum gauge, measuring range 10-5Pa~105Pa) CY-GZK60 series small molecular pump set(including composite vacuum gauge, measuring range 10-5Pa~102Pa) VRD-4 bipolar rotary vane vacuum pump 2,KF25 Vacuum bellows; The length can be 0.5m, 1m or 1.5m. KF40 clamp bracket 3,Film thickness meter crystal oscillator; |