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Desktop Bottom-target Magnetron Sputtering Coater for Sensitive Film With Stainless Steel Chamber

Desktop Bottom-target Magnetron Sputtering Coater can be used for preparing single-layer or multi-layer ferroelectric thin films, conductive films, alloy films, and the like. Compared with similar equipment, the dual-target magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing material films in a laboratory
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  • TN-MSP190S-1T-UD

  • TN

The desktop bottom-target magnetron sputtering coater utilizes advanced magnetron sputtering technology, allowing for efficient and reliable film deposition. With its user-friendly interface, operators can easily control the deposition parameters and monitor the coating process in real-time.


This coater is capable of depositing films on various substrates, including glass, silicon, and metal. It offers a wide range of deposition materials, such as metals, alloys, and oxides, providing flexibility for different research and industrial applications.


The magnetron sputtering coater ensures excellent film quality, with high adhesion, uniform thickness, and low surface roughness. It enables precise control over film composition and thickness, resulting in consistent and reproducible film properties.


With its compact design, this desktop coater is suitable for laboratories, research institutes, and small-scale production facilities. It requires minimal installation space and can be easily integrated into existing setups.


In summary, the desktop bottom-target magnetron sputtering coater for sensitive film with a stainless steel chamber offers advanced film deposition capabilities, precise control over coating parameters, and excellent film quality. It is an ideal choice for researchers and professionals seeking reliable and efficient thin film deposition solutions.

magnetron sputtering coater Technical Parameters:

Product Name

Desktop bottom-single-target sputtering coater with stainless steel   cavity

Product Model

TN-MSP190S-1T-UD    (under)

Installation Condition

1,Working environment temperature: 25℃±15℃,humidity: 55%Rh±10%Rh;

2,Equipment power supply:AC220V,50Hz, must be well grounded;

3,Rated power:1000w;

4,Equipment for gas:The equipment chamber should be filled with argon gas for cleaning.   The customer should prepare argon gas with purity ≥99.99%.

5,Table size requirements: 600mm×600mm×700mm,bearing capacity ≥ 50kg;

6,The position should be well ventilated and cooled.

Technical Indicators

1、 Sputtering power supply:DC power supply 300W;maximum output voltage   600V,limited   current output 500mA

2、 Magnetron target:2 inch balance target,magnetic coupling baffle;

3、 Suitable target material: φ50mm x 3mm in thickness

4、 Cavity size :outside   diameter194,inside diameter186mm x height 230mm

5、 Cavity material: 304 stainless steel

6、 Rotating heating sample   table:rotate   speed 1~20rpm  continuously adjustable;maximum heating temperature   500℃,the lowest recommended   heating rate 10℃/min,the highest recommended   heating rate 20℃/min.

7、 Cooling mode :magnetic target and   molecular pump require circulating water cooler

8、 Water-cooling machine:the tank volume 9L,flow rate 10L/min

9、 Gas supply system:mass flow meter, type of gas Argon,flow 1~30sccm(customizable)

10、 Accuracy of flow meter :±1.5% measuring range

11、 The air pumping interface   of the vacuum chamber is KF25

12、 Air intake interface is   1/4 inch double ferrule joint

13、 Touch screen is 7inch color   touch screen

14、 Adjustable sputtering   current,sputtering   safety current value and safety vacuum value can be set;

15、  safety protection: over current, vacuum is too low   automatically cut off the sputtering current

16、 Ultimate vacuum:5E-4Pa(matching molecular   pump);

17、 Vacuum   measurement is Parana vacuum gauge,the range is:1~105Pa

Notice

1,Magnetron sputtering   has a high working vacuum, generally within 2Pa, and needs to be used with   molecular pump.

2,In order to achieve a   high oxygen free environment, the vacuum chamber should be cleaned at least 3   times with high purity inert gas。

3,Magnetron sputtering is   sensitive to the air intake, so mass flow meter is needed to control the air   intake

Optional   accessory

Film

thickness   Monitor

1,Film thickness resolution:0.0136Å(aluminum)

2,Accuracy of film   thickness :±0.5%,it depends on process   conditions, especially sensor position, material stress, temperature and   density  

3,Measuring speed:100ms-1s/times,measurement range can be   set :500000Å(aluminum)

4,Standard sensor crystal:6MHz

5,Suitable for wafer   frequency:6MHz  

suitable for wafer size:Φ14mm

mounting   flange:CF35

Another Accessory

·            1,CY-CZK103 series high performance   molecular pump set(including composite vacuum gauge, measuring range   10-5Pa~105Pa)

CY-GZK60 series small molecular pump set(including composite vacuum gauge, measuring range   10-5Pa~102Pa)

VRD-4 bipolar rotary vane   vacuum pump

2,KF25   Vacuum bellows; The length can be 0.5m, 1m or 1.5m. KF40 clamp bracket

3,Film thickness meter   crystal oscillator;



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