| Quantity: | |
|---|---|
TN-MSP500S-DC-RF
TN
This equipment is a desktop single sputter head magnetron sputtering coating machine. The miniaturized design of the equipment limits the appearance of the equipment to the desktop level, greatly reducing the installation site requirements. The equipment is equipped with a DC power supply, which can be used for sputtering metal materials and has the characteristics of fast speed and low temperature rise.
Single Sputter Head Magnetron Sputtering Coater with Stainless Steel Chamber can be used for preparing single-layer or multi-layer ferroelectric thin films, conductive films, alloy films, and the like. Compared with similar equipment, the dual-target magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing material films in a laboratory
Technical parameters:
Supply Voltage | VAC 220, 60Hz |
Vacuum Chamber | Dimension: Dia. 300 mm * H 300 mm Material: 304 stainless steel Viewport (Window): ~4'' (100mm) with shutter |
Top Chamber | Center top sample holder Sample size: Max. 4'' diameter Rotary speed: 0-20rpm adjustable Heating temperature: up to 300oC |
Bottom Chamber | 2 × 2'' magnetron sputter guns, with automatic shutter each gun, all CON-FOCAL, sputtering orientation upwards 1 Thermo evaporation resistive, low volt, 500W power |
DC Generator | Quantity: 1 set Output power: 0~500W Output voltage: 0~600V Timing length: 65000S Soft start time: 1~10S Max. output current: 1 A Load regulation: >99.86% Short circuit response time: <5mS Control accuracy: 1%±1 |
Film thickness monitor | Quartz Monitor Crystal: 6MHz |
Vacuum pump system | Limited vacuum: 10-5Pa |
Water Chiller | Cooling water temperature: 37℃ Flow rate: 10L/min Power: 0.1KW Cooling power: 50W/℃ Tank capacity: 9L |
Mass Flow Meter | 1 × MFC mass flow control With Electric Vacuum Valve to Close Gas Fow |
This equipment is a desktop single sputter head magnetron sputtering coating machine. The miniaturized design of the equipment limits the appearance of the equipment to the desktop level, greatly reducing the installation site requirements. The equipment is equipped with a DC power supply, which can be used for sputtering metal materials and has the characteristics of fast speed and low temperature rise.
Single Sputter Head Magnetron Sputtering Coater with Stainless Steel Chamber can be used for preparing single-layer or multi-layer ferroelectric thin films, conductive films, alloy films, and the like. Compared with similar equipment, the dual-target magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing material films in a laboratory
Technical parameters:
Supply Voltage | VAC 220, 60Hz |
Vacuum Chamber | Dimension: Dia. 300 mm * H 300 mm Material: 304 stainless steel Viewport (Window): ~4'' (100mm) with shutter |
Top Chamber | Center top sample holder Sample size: Max. 4'' diameter Rotary speed: 0-20rpm adjustable Heating temperature: up to 300oC |
Bottom Chamber | 2 × 2'' magnetron sputter guns, with automatic shutter each gun, all CON-FOCAL, sputtering orientation upwards 1 Thermo evaporation resistive, low volt, 500W power |
DC Generator | Quantity: 1 set Output power: 0~500W Output voltage: 0~600V Timing length: 65000S Soft start time: 1~10S Max. output current: 1 A Load regulation: >99.86% Short circuit response time: <5mS Control accuracy: 1%±1 |
Film thickness monitor | Quartz Monitor Crystal: 6MHz |
Vacuum pump system | Limited vacuum: 10-5Pa |
Water Chiller | Cooling water temperature: 37℃ Flow rate: 10L/min Power: 0.1KW Cooling power: 50W/℃ Tank capacity: 9L |
Mass Flow Meter | 1 × MFC mass flow control With Electric Vacuum Valve to Close Gas Fow |
