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Three Target Magnetron Sputtering Coater with Transition Chamber for Ceramic Film

This device can be used for preparing single-layer or multi-layer ferroelectric thin films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, and the like
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  • TN-MSP325G-3T-DVC-2DC-1RF

  • TN

This coater is designed for high precision and efficiency, with a user-friendly interface for easy operation. It offers adjustable sputtering parameters such as power, pressure, and deposition time, allowing for precise control over film thickness and quality. The DC magnetron sputtering technology ensures uniform film deposition and excellent adhesion to the substrate.


With its compact and robust design, this coater is suitable for both research and industrial applications. It is equipped with safety features such as overcurrent protection and water cooling system, ensuring reliable and safe operation. The high vacuum system guarantees a clean and contamination-free deposition environment.


Whether you are working in the field of material science, electronics, or optics, this three-target magnetron sputtering coater with transition chamber is an ideal choice for your thin film deposition needs. It offers versatility, precision, and reliability, making it a valuable tool for any laboratory or production facility.


Three target magnetron sputtering coater Technical Parameters:


Product name

Three target magnetron sputtering coater 

Product model

TN-MSP325G-3T-DVC-2DC-1RF

Installation conditions

1. Operating environment temperature 25℃±15℃, humidity 55%Rh±10%Rh;

2. Equipment power supply: AC220V, 50Hz, must be well grounded;

3. Rated power: 5000w;

4. Equipment gas: the equipment chamber needs to be filled with argon for cleaning, and the customer needs to prepare argon, with a purity of ≥99.99%;

5. The size of the venue is 1200mm×1200mm×2000mm;

6. The placement position requires good ventilation and heat dissipation.

Technical parameters

1. Sputtering power supply: DC power supply 500W x2; maximum output voltage 600V, limit output current 1000mA

2. Magnetron target: 2-inch balanced target with magnetic coupling baffle;

3. Applicable target material for magnetron target: φ50mm x 3mm thick conductive metal target material

4. Cavity size: main cavity φ325mm x 410mm; transition cavity 150x150x150mm

5. Chamber function: The main chamber is equipped with a side door sealed by a sealing ring, a quartz observation window with a baffle, and a manual operating rod for transferring samples. The transition chamber is equipped with an upper cover with a quartz window sealed by a sealing ring, a magnetic coupling push rod for transporting samples into the main chamber, and an independent vacuum system.

6. Cavity material: stainless steel 304

7. Rotating heating sample table: The speed is continuously adjustable from 1 to 20 rpm; the heating temperature is up to 500°C, and the heating rate is recommended to be 10°C/min, and the maximum temperature is 20°C/min.

8. Cooling method: Magnetron target and molecular pump need circulating water cooler;

9. Water cooler: water tank volume 9L, flow rate 10L/min

10. Gas supply system: mass flow meter, gas type AR gas, flow rate 1~200sccm (customizable);

11. Flow meter accuracy: ±1.5% range

12. The pumping interface of the vacuum chamber is CF160;

13. The air inlet interface is a 1/4 inch double ferrule joint;

14. The display is 14 industrial computer all-in-one computers;

15. The sputtering current can be adjusted, and the sputtering safe current value and safe vacuum value can be set;

16. Safety protection: Sputtering current will be automatically cut off when overcurrent and vacuum are too low;

17. Vacuum system: the main chamber is equipped with a TN-GZK103 high vacuum molecular pump set with a pumping speed of 600L/s; the transition chamber is equipped with a small molecular pump set with a pumping speed of 60L/s. The two sets of vacuum systems can work and control independently, and the pneumatic valves between the chambers and in the vacuum system are all controlled by programs, which can realize one-key action, which is convenient and quick.

18. Ultimate vacuum: 5E-4Pa (with molecular pump);

19. The vacuum measurement is a composite vacuum gauge, and its range is: 10-5Pa~105Pa

Precautions

1. In order to achieve a higher oxygen-free environment, the vacuum chamber must be cleaned with high-purity inert gas at least 3 times.

2. Magnetron sputtering is more sensitive to the intake air volume, and a mass flow meter needs to be used to control the intake air volume.

3. Keep the cavity in a vacuum when the equipment is not in use.

4. If it has not been vacuumed for a long time, it should be degassed when it is used again to improve the vacuum performance.

Optional accessories

Film thickness monitor

1. Film thickness resolution: 0.0136Å (aluminum)

2. Film thickness accuracy: ±0.5%, depending on the process conditions, especially the position of the sensor, material stress, temperature and density

3. Measurement speed: 100ms-1s/time, the measurement range can be set: 500000Å (aluminum)

4. Standard sensor crystal: 6MHz

5. Applicable chip frequency: 6MHz Applicable chip size: Φ14mm Mounting flange: CF35

Other accessories

1. TN-CZK103 series high-performance molecular pump set (including compound vacuum gauge, measuring range 10-5Pa~105Pa);

TN-GZK60 series small molecular pump set (including compound vacuum gauge, measuring range 10-5Pa~102Pa)

VRD-4 bipolar rotary vane vacuum pump;

2. KF25/40 vacuum bellows; length can be 0.5m, 1m, 1.5m; KF25 clamp bracket

3. Crystal oscillator of film thickness meter;


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