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TN-MSV325-II-DCDC-SS
TN
High Vacuum Dual-Target Magnetron Sputtering Coating Machine is a cutting-edge piece of equipment designed for microelectronics and semiconductor manufacturing. This machine is specifically engineered for depositing high-quality multilayer films and coatings on various substrates.
With the ability to handle multiple targets simultaneously, this machine is ideal for producing complex structures and advanced materials used in magnetic and spintronic devices. The high vacuum environment ensures precise control over the deposition process, resulting in uniform and high-performance coatings.
The High Vacuum Dual-Target Magnetron Sputtering Coating Machine is capable of depositing hard coatings such as titanium nitride (TiN) and chromium nitride (CrN), which are commonly used in the semiconductor industry for their excellent wear resistance and thermal stability.
This state-of-the-art machine offers unparalleled precision and efficiency, making it a valuable asset for research and development laboratories, as well as production facilities. Its advanced features and robust construction ensure reliable and consistent performance, making it the perfect choice for demanding applications in the microelectronics and semiconductor industry.
Product name | Split type High Vacuum Dual-Target Magnetron Sputtering Coating Machine | |
Product model | TN-MSV325-II-DCDC-SS | |
Power supply voltage | AC220V，50Hz | |
Complete power | 6KW | |
System vacuum | ≦5×10-4Pa | |
Sample stage | Dimensions | φ150mm |
Heating temperature | ≦600℃ | |
Temperature control accuracy | ±1℃ | |
Adjustable speed | ≦20rpm | |
Magnetic target gun | Target size | Diameter Φ50.8mm, thickness ≤3mm |
Cooling mode | Circulating water cooling | |
Water flow size | Not less than 10L/Min | |
Quantity | 2 | |
Vacuum chamber | Cavity size | Diameter φ325mm, height 500mm |
Cavity material | SUU304 stainless steel | |
Observation window | Diameter φ100mm | |
Opening method | Top opening | |
Gas control | 1 mass flow meter is used to control the Ar flow, with a range of 200SCCM | |
Vacuum system | Equipped with 1 molecular pump system, gas pumping speed 600L/S | |
Film thickness measurement | Optional quartz crystal film thickness meter, resolution 0.10 Å | |
Sputtering power supply | Equipped with DC power supply, power 500W*2 | |
Control system | CYKY self-developed professional control system | |
Equipment dimensions | 540mm×540mm×1000mm | |
Equipment weight | 145kg | |
high vacuum dual-target magnetron sputtering coating machine is a specialized piece of equipment designed for the deposition of thin films using two separate targets (materials) in a high vacuum environment. This configuration allows for a wide range of applications and provides flexibility in creating complex and multilayer coatings. Here are the primary areas where this type of machine is available and commonly used:
Microelectronics and Semiconductor Manufacturing:
Multilayer Films: The dual-target setup is ideal for depositing multilayer films, where different materials can be sequentially or simultaneously deposited to create complex structures essential for semiconductor devices.
Conductive and Insulating Layers: This machine is used to deposit both conductive (e.g., metals like copper or aluminum) and insulating (e.g., silicon dioxide, silicon nitride) layers in the fabrication of integrated circuits and other microelectronic components.
Optical Coatings:
Antireflective and Reflective Coatings: The machine is used to create optical coatings that require precise control of film thickness and material composition. By using two targets, it’s possible to create gradient-index coatings or complex multilayer stacks for lenses, mirrors, and optical filters.
Dielectric Mirrors and Beam Splitters: These components often require alternating layers of different materials, which can be efficiently deposited using a dual-target system.
Magnetic and Spintronic Devices:
Magnetic Thin Films: The machine is used to deposit magnetic materials, such as cobalt, nickel, or iron alloys, which are crucial in the production of magnetic storage devices like hard drives and MRAM (Magnetoresistive Random-Access Memory).
Spintronic Applications: Dual-target sputtering is essential for creating multilayer structures used in spintronics, where the spin of electrons is exploited in addition to their charge.
Hard and Wear-Resistant Coatings:
Tooling and Cutting Instruments: The machine is used to deposit hard coatings, such as titanium nitride (TiN), chromium nitride (CrN), or diamond-like carbon (DLC), onto tools, dies, and other mechanical components to enhance their wear resistance and durability.
Protective Coatings: These coatings are also used in various industrial applications where surfaces need protection against corrosion, oxidation, and other forms of wear.
Energy Devices:
Solar Cells: Dual-target sputtering is used to deposit the various layers required in thin-film solar cells, such as transparent conductive oxides (TCOs) and absorber layers. This allows for the development of efficient photovoltaic devices.
Fuel Cells and Batteries: The machine can deposit thin films used in energy storage and conversion devices, such as electrode materials in batteries or protective layers in fuel cells.
Research and Development:
Material Science and Nanotechnology: In R&D settings, this machine is used to explore new materials and thin-film structures. The ability to deposit two different materials simultaneously or sequentially enables the development of novel materials with tailored properties.
Prototyping and Experimentation: Researchers use dual-target systems to prototype new devices, study material interactions, and optimize thin-film deposition processes.
Decorative and Functional Coatings:
Consumer Electronics and Jewelry: The machine is used to apply decorative metallic coatings on consumer products, such as electronics and jewelry. These coatings can also provide functional benefits, such as scratch resistance or enhanced conductivity.
Architectural Glass: Dual-target sputtering is used to create coatings on architectural glass that provide energy efficiency, UV protection, and aesthetic enhancements.
Superconducting Films:
Superconductor Research: The machine is used to deposit superconducting materials, such as YBCO (Yttrium Barium Copper Oxide), for research in superconductivity and the development of superconducting devices.
Overall, a high vacuum dual-target magnetron sputtering coating machine is highly versatile and is used across multiple industries and research fields to create a wide range of thin-film materials with specific properties. Its ability to handle two targets simultaneously or in sequence allows for the development of complex, multilayer coatings tailored to the needs of specific applications.
High Vacuum Dual-Target Magnetron Sputtering Coating Machine is a cutting-edge piece of equipment designed for microelectronics and semiconductor manufacturing. This machine is specifically engineered for depositing high-quality multilayer films and coatings on various substrates.
With the ability to handle multiple targets simultaneously, this machine is ideal for producing complex structures and advanced materials used in magnetic and spintronic devices. The high vacuum environment ensures precise control over the deposition process, resulting in uniform and high-performance coatings.
The High Vacuum Dual-Target Magnetron Sputtering Coating Machine is capable of depositing hard coatings such as titanium nitride (TiN) and chromium nitride (CrN), which are commonly used in the semiconductor industry for their excellent wear resistance and thermal stability.
This state-of-the-art machine offers unparalleled precision and efficiency, making it a valuable asset for research and development laboratories, as well as production facilities. Its advanced features and robust construction ensure reliable and consistent performance, making it the perfect choice for demanding applications in the microelectronics and semiconductor industry.
Product name | Split type High Vacuum Dual-Target Magnetron Sputtering Coating Machine | |
Product model | TN-MSV325-II-DCDC-SS | |
Power supply voltage | AC220V，50Hz | |
Complete power | 6KW | |
System vacuum | ≦5×10-4Pa | |
Sample stage | Dimensions | φ150mm |
Heating temperature | ≦600℃ | |
Temperature control accuracy | ±1℃ | |
Adjustable speed | ≦20rpm | |
Magnetic target gun | Target size | Diameter Φ50.8mm, thickness ≤3mm |
Cooling mode | Circulating water cooling | |
Water flow size | Not less than 10L/Min | |
Quantity | 2 | |
Vacuum chamber | Cavity size | Diameter φ325mm, height 500mm |
Cavity material | SUU304 stainless steel | |
Observation window | Diameter φ100mm | |
Opening method | Top opening | |
Gas control | 1 mass flow meter is used to control the Ar flow, with a range of 200SCCM | |
Vacuum system | Equipped with 1 molecular pump system, gas pumping speed 600L/S | |
Film thickness measurement | Optional quartz crystal film thickness meter, resolution 0.10 Å | |
Sputtering power supply | Equipped with DC power supply, power 500W*2 | |
Control system | CYKY self-developed professional control system | |
Equipment dimensions | 540mm×540mm×1000mm | |
Equipment weight | 145kg | |
high vacuum dual-target magnetron sputtering coating machine is a specialized piece of equipment designed for the deposition of thin films using two separate targets (materials) in a high vacuum environment. This configuration allows for a wide range of applications and provides flexibility in creating complex and multilayer coatings. Here are the primary areas where this type of machine is available and commonly used:
Microelectronics and Semiconductor Manufacturing:
Multilayer Films: The dual-target setup is ideal for depositing multilayer films, where different materials can be sequentially or simultaneously deposited to create complex structures essential for semiconductor devices.
Conductive and Insulating Layers: This machine is used to deposit both conductive (e.g., metals like copper or aluminum) and insulating (e.g., silicon dioxide, silicon nitride) layers in the fabrication of integrated circuits and other microelectronic components.
Optical Coatings:
Antireflective and Reflective Coatings: The machine is used to create optical coatings that require precise control of film thickness and material composition. By using two targets, it’s possible to create gradient-index coatings or complex multilayer stacks for lenses, mirrors, and optical filters.
Dielectric Mirrors and Beam Splitters: These components often require alternating layers of different materials, which can be efficiently deposited using a dual-target system.
Magnetic and Spintronic Devices:
Magnetic Thin Films: The machine is used to deposit magnetic materials, such as cobalt, nickel, or iron alloys, which are crucial in the production of magnetic storage devices like hard drives and MRAM (Magnetoresistive Random-Access Memory).
Spintronic Applications: Dual-target sputtering is essential for creating multilayer structures used in spintronics, where the spin of electrons is exploited in addition to their charge.
Hard and Wear-Resistant Coatings:
Tooling and Cutting Instruments: The machine is used to deposit hard coatings, such as titanium nitride (TiN), chromium nitride (CrN), or diamond-like carbon (DLC), onto tools, dies, and other mechanical components to enhance their wear resistance and durability.
Protective Coatings: These coatings are also used in various industrial applications where surfaces need protection against corrosion, oxidation, and other forms of wear.
Energy Devices:
Solar Cells: Dual-target sputtering is used to deposit the various layers required in thin-film solar cells, such as transparent conductive oxides (TCOs) and absorber layers. This allows for the development of efficient photovoltaic devices.
Fuel Cells and Batteries: The machine can deposit thin films used in energy storage and conversion devices, such as electrode materials in batteries or protective layers in fuel cells.
Research and Development:
Material Science and Nanotechnology: In R&D settings, this machine is used to explore new materials and thin-film structures. The ability to deposit two different materials simultaneously or sequentially enables the development of novel materials with tailored properties.
Prototyping and Experimentation: Researchers use dual-target systems to prototype new devices, study material interactions, and optimize thin-film deposition processes.
Decorative and Functional Coatings:
Consumer Electronics and Jewelry: The machine is used to apply decorative metallic coatings on consumer products, such as electronics and jewelry. These coatings can also provide functional benefits, such as scratch resistance or enhanced conductivity.
Architectural Glass: Dual-target sputtering is used to create coatings on architectural glass that provide energy efficiency, UV protection, and aesthetic enhancements.
Superconducting Films:
Superconductor Research: The machine is used to deposit superconducting materials, such as YBCO (Yttrium Barium Copper Oxide), for research in superconductivity and the development of superconducting devices.
Overall, a high vacuum dual-target magnetron sputtering coating machine is highly versatile and is used across multiple industries and research fields to create a wide range of thin-film materials with specific properties. Its ability to handle two targets simultaneously or in sequence allows for the development of complex, multilayer coatings tailored to the needs of specific applications.
