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TN-MSP360G-1DC
TN
Introducing our Single Target DC Magnetron Sputtering Coater, an advanced and versatile equipment designed for precision film preparation. With its exceptional capabilities, this coater is ideal for creating single or multi-layer films in various applications including ferroelectric, conductive, alloy, semiconductor, ceramic, dielectric, optical, oxide, and hard films.
Our state-of-the-art coater utilizes cutting-edge magnetron sputtering technology, ensuring precise and uniform deposition of materials onto substrates. This enables researchers and manufacturers to achieve superior film quality and consistency, meeting the demands of even the most intricate projects.
Featuring a robust construction and a user-friendly interface, our Single Target DC Magnetron Sputtering Coater offers unparalleled reliability and ease of operation. Its advanced control system allows for precise control of deposition parameters such as film thickness, deposition rate, and target utilization, providing users with unmatched flexibility and accuracy.
Equipped with a high-performance vacuum system, this coater ensures a clean and contamination-free environment during the deposition process. Additionally, its efficient cooling system guarantees optimal temperature control, preventing any potential damage to sensitive materials.
Designed with the utmost attention to detail, our Single Target DC Magnetron Sputtering Coater is built to withstand rigorous use and deliver exceptional results. Its compact footprint makes it suitable for various laboratory or industrial settings, while its energy-efficient design helps reduce operational costs without compromising performance.
Invest in our Single Target DC Magnetron Sputtering Coater and unlock limitless possibilities in film preparation. With its outstanding features and professional-grade performance, this equipment is the perfect choice for researchers, engineers, and manufacturers seeking to achieve excellence in their film deposition processes.
Single target DC magnetron sputtering coater | ||
Sample Table | Overall dimensions | Φ 360 mm |
Adjustable RPM | 1-20rpm adjustable | |
Magneto-c ontrolled target gun | Target plane | Circular plane target |
Sputtering vacuum | 0.1Pa to 3Pa | |
Target diameter | 100 to 101.6mm | |
Target thickness | 3mm | |
Insulation voltage | >2000V | |
Cable specifications | SL-16 | |
Target head temperature | ≦ 65 ℃ | |
Vacuum chamber | Inner wall treatment | Electrolytic polishing |
Cavity size | Φ500mm x 500mm | |
Cavity material | 304 stainless steel | |
Viewing window | Quartz window, φ100mm diameter | |
Opening method | Side opening | |
Gas control | Flow control | Mass flowmeter, measuring range 0 ~ 100SCCM |
Gas type | Argon, nitrogen, oxygen and other gases are available | |
Regulator Valve Types | Solenoid Regulator | |
Static state of regulator valve | Normal close | |
Measuring linearity | Plus or minus 1.5% F.S | |
Measurement repetition accuracy | Plus or minus 0.2% F.S | |
Measure response time | ≤8 seconds (T95) | |
Range of working pressure difference | 0.3 MPa | |
Pressure resistant body | 3MPa | |
Working ambient temperature | (5 ~ 45) ℃ | |
Body material | Stainless steel 316L | |
Leakage rate of body | 1×10-8Pa.m3/s | |
Pipe fittings | 1/4 "jacketed joints | |
Input/output signals | 0 to 5V | |
Power supply | ±15V (±5%) (+15V 50mA, -15V 200mA) | |
Overall dimensions mm | 130 (W) x 102 (H) x 28 (H) | |
Communication interface | RS485 MODBUS protocol | |
DC power supply | Power supply | 1500W |
Film thickness measureme nt | Power requirements | DC:5V (±10%) Maximum current 400mA |
Resolution | ±0.03Hz(5-6MHz), 0.0136A/measurement (aluminum) | |
Measurement accuracy | ±0.5% thickness +1 count | |
Measurement cycle | 100mS ~ 1S/ time (can be set) | |
Measuring range | 500,000 A (aluminum) | |
Crystal frequency | 6MHz | |
Communication interface | RS-232/485 serial interface | |
Display bits | 8-bit LED display | |
Molecular pump | Molecular pumping speed | 1200L/S |
Rated speed | 24000rpm | |
Vibration value | ≦ 0.1 um | |
Start-up time | 5min | |
Downtime | 7min | |
Cooling method | Water cooling + air cooling | |
Cooling water temperature | ≦37℃ | |
Cooling water flow rate | 1L/min | |
Mounting direction | Vertical ±5。 | |
Air extraction interface | 150CF | |
Exhaust port | KF40 | |
Front pump | Pumping rate | VRD-16 |
Ultimate vacuum | 1Pa | |
Power supply | AC:220V/50Hz | |
Motor power | 400W | |
Noise | ≦56db | |
Air extraction interface | KF40 | |
Exhaust port | KF25 | |
Valve | Gate valve | A gate valve is arranged between the vacuum chamber and the molecular pump |
Cut-off valve | A cut-off valve is installed between the molecular pump and the front stage | |
Side drain valve | A side drain valve is installed between the vacuum chamber and the front stage | |
Bleeder valve | An electromagnetic bleeder valve is installed on the vacuum chamber | |
Ultimate vacuum of the whole machine | ≦5X10-4Pa | |
Test target | 1 piece of nickel target 4 inches in diameter and 3mm thick | |
Introducing our Single Target DC Magnetron Sputtering Coater, an advanced and versatile equipment designed for precision film preparation. With its exceptional capabilities, this coater is ideal for creating single or multi-layer films in various applications including ferroelectric, conductive, alloy, semiconductor, ceramic, dielectric, optical, oxide, and hard films.
Our state-of-the-art coater utilizes cutting-edge magnetron sputtering technology, ensuring precise and uniform deposition of materials onto substrates. This enables researchers and manufacturers to achieve superior film quality and consistency, meeting the demands of even the most intricate projects.
Featuring a robust construction and a user-friendly interface, our Single Target DC Magnetron Sputtering Coater offers unparalleled reliability and ease of operation. Its advanced control system allows for precise control of deposition parameters such as film thickness, deposition rate, and target utilization, providing users with unmatched flexibility and accuracy.
Equipped with a high-performance vacuum system, this coater ensures a clean and contamination-free environment during the deposition process. Additionally, its efficient cooling system guarantees optimal temperature control, preventing any potential damage to sensitive materials.
Designed with the utmost attention to detail, our Single Target DC Magnetron Sputtering Coater is built to withstand rigorous use and deliver exceptional results. Its compact footprint makes it suitable for various laboratory or industrial settings, while its energy-efficient design helps reduce operational costs without compromising performance.
Invest in our Single Target DC Magnetron Sputtering Coater and unlock limitless possibilities in film preparation. With its outstanding features and professional-grade performance, this equipment is the perfect choice for researchers, engineers, and manufacturers seeking to achieve excellence in their film deposition processes.
Single target DC magnetron sputtering coater | ||
Sample Table | Overall dimensions | Φ 360 mm |
Adjustable RPM | 1-20rpm adjustable | |
Magneto-c ontrolled target gun | Target plane | Circular plane target |
Sputtering vacuum | 0.1Pa to 3Pa | |
Target diameter | 100 to 101.6mm | |
Target thickness | 3mm | |
Insulation voltage | >2000V | |
Cable specifications | SL-16 | |
Target head temperature | ≦ 65 ℃ | |
Vacuum chamber | Inner wall treatment | Electrolytic polishing |
Cavity size | Φ500mm x 500mm | |
Cavity material | 304 stainless steel | |
Viewing window | Quartz window, φ100mm diameter | |
Opening method | Side opening | |
Gas control | Flow control | Mass flowmeter, measuring range 0 ~ 100SCCM |
Gas type | Argon, nitrogen, oxygen and other gases are available | |
Regulator Valve Types | Solenoid Regulator | |
Static state of regulator valve | Normal close | |
Measuring linearity | Plus or minus 1.5% F.S | |
Measurement repetition accuracy | Plus or minus 0.2% F.S | |
Measure response time | ≤8 seconds (T95) | |
Range of working pressure difference | 0.3 MPa | |
Pressure resistant body | 3MPa | |
Working ambient temperature | (5 ~ 45) ℃ | |
Body material | Stainless steel 316L | |
Leakage rate of body | 1×10-8Pa.m3/s | |
Pipe fittings | 1/4 "jacketed joints | |
Input/output signals | 0 to 5V | |
Power supply | ±15V (±5%) (+15V 50mA, -15V 200mA) | |
Overall dimensions mm | 130 (W) x 102 (H) x 28 (H) | |
Communication interface | RS485 MODBUS protocol | |
DC power supply | Power supply | 1500W |
Film thickness measureme nt | Power requirements | DC:5V (±10%) Maximum current 400mA |
Resolution | ±0.03Hz(5-6MHz), 0.0136A/measurement (aluminum) | |
Measurement accuracy | ±0.5% thickness +1 count | |
Measurement cycle | 100mS ~ 1S/ time (can be set) | |
Measuring range | 500,000 A (aluminum) | |
Crystal frequency | 6MHz | |
Communication interface | RS-232/485 serial interface | |
Display bits | 8-bit LED display | |
Molecular pump | Molecular pumping speed | 1200L/S |
Rated speed | 24000rpm | |
Vibration value | ≦ 0.1 um | |
Start-up time | 5min | |
Downtime | 7min | |
Cooling method | Water cooling + air cooling | |
Cooling water temperature | ≦37℃ | |
Cooling water flow rate | 1L/min | |
Mounting direction | Vertical ±5。 | |
Air extraction interface | 150CF | |
Exhaust port | KF40 | |
Front pump | Pumping rate | VRD-16 |
Ultimate vacuum | 1Pa | |
Power supply | AC:220V/50Hz | |
Motor power | 400W | |
Noise | ≦56db | |
Air extraction interface | KF40 | |
Exhaust port | KF25 | |
Valve | Gate valve | A gate valve is arranged between the vacuum chamber and the molecular pump |
Cut-off valve | A cut-off valve is installed between the molecular pump and the front stage | |
Side drain valve | A side drain valve is installed between the vacuum chamber and the front stage | |
Bleeder valve | An electromagnetic bleeder valve is installed on the vacuum chamber | |
Ultimate vacuum of the whole machine | ≦5X10-4Pa | |
Test target | 1 piece of nickel target 4 inches in diameter and 3mm thick | |
