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TN-VTC-DC
TN
This sputtering coater utilizes DC magnetron sputtering technology, allowing for efficient and uniform film deposition. It is capable of depositing films on various substrates, including glass, silicon, and metal, with excellent adhesion and uniformity.
The single target design of this coater enables the deposition of single-layer films, as well as the sequential deposition of multiple layers for complex film structures. With its adjustable sputtering power and deposition time, it offers flexibility in achieving desired film thickness and properties.
Equipped with a reliable vacuum system, this coater can achieve high vacuum levels, ensuring a contamination-free environment for the coating process. The stainless steel chamber provides excellent resistance to corrosion and ensures long-lasting performance.
The user-friendly interface and intuitive control panel make operation simple and convenient. The coater is equipped with advanced safety features, including overcurrent protection and automatic power-off, ensuring the safety of both the user and the equipment.
Whether in research laboratories or industrial settings, this Single Target DC Magnetron Sputtering Coater with High Vacuum Stainless Steel Chamber is an ideal choice for precise and reliable thin film deposition. Its versatility and robust construction make it suitable for a wide range of applications, including materials science, electronics, optics, and more.
Technical parameters of single target magnetron sputtering coater:
Single target DC magnetron sputtering coating instrument | ||
Sample stage | Dimensions | φ185mm |
Heating range | Room temperature~500℃ | |
Adjustable speed | 1-20rpm adjustable | |
magnetic control target gun | Target plane | Circular plane target |
Sputtering vacuum | 10Pa~0.2Pa | |
Target diameter | 50~50.8mm | |
Target thickness | 2~5mm | |
Insulation voltage | >2000V | |
Cable specifications | SL-16 | |
Target head temperature | ≦65℃ | |
real null Cavity body | Inner wall treatment | Electrolytic polishing |
Cavity size | φ300mm × 300mm | |
Cavity material | 304 stainless steel | |
Observation window | Quartz window, diameter φ100mm | |
Open method | Top opening, cylinder auxiliary support | |
gas body control system | Flow control | Mass flow meter, range 0~200SCCM argon gas |
Control valve type | Solenoid valve | |
Control valve static state | Normally closed | |
Measuring linearity | ±1.5%F.S | |
Measurement repeatability | ±0.2%F.S | |
Measuring response time | ≤8 second(T95) | |
Working pressure range | 0.3MPa | |
Valve body pressure | 3MPa | |
Working temperature | (5~45)℃ | |
Body material | Stainless steel 316L | |
Valve body leakage rate | 1×10-8Pa.m3/s | |
Pipe joints | 1/4″Compression fitting | |
Input and output signal | 0~5V | |
Power supply | ±15V(±5%)(+15V 50mA, -15V 200mA) | |
Overall dimensions mm | 130 (width) × 102 (height) × 28 (thickness) | |
Communication Interface | RS485 MODBUS protocol | |
DC power supply | Power | 500W |
Output voltage | 0~600V | |
Timing length | 65000 second | |
Start Time | 1~10 second | |
Film thickness measurement | Power requirements | DC:5V(±10%) Maximum current 400mA |
Resolution | ±0.03Hz(5-6MHz),0.0136Å / Measurement (aluminum) | |
Measurement accuracy | ±0.5% thickness + 1 count | |
Measurement period | 100mS~1S/time (can be set) | |
Measuring range | 500,000 Å (aluminum) | |
Crystal frequency | 6MHz | |
Communication Interface | RS-232/485 serial interface | |
Display digits | 8-digit LED display | |
Molecular pump | Molecular pump pumping speed | 80L/S |
Rated speed | 65000rpm | |
Vibration value | ≦0.1um | |
Start Time | ≦4.5min | |
Downtime | <7min | |
Cooling method | Air-cooled | |
Cooling water temperature | ≦37℃ | |
Cooling water flow rate | 1L/min | |
Installation direction | Vertical ±5° | |
Suction port | 150CF | |
Exhaust connection | KF40 | |
Fore pump | Pumping rate | 1.1L/S(VRD-4) |
Ultimate vacuum | 5×10-2Pa | |
Power supply | AC:220V/50Hz | |
Power | 400W | |
Noise | ≦56db | |
Suction port | KF40 | |
Exhaust connection | KF25 | |
Release valve | Pneumatic and electronically controlled air release valve is installed on the vacuum chamber | |
The ultimate vacuum of the whole machine | ≦5×10-4Pa | |
Vacuum chamber boost rate | ≦2.5Pa/h | |
Software system | 1 set of monitoring and management software | |
Test target | 2 copper targets with a diameter of 2 inches and a thickness of 3 mm |
This sputtering coater utilizes DC magnetron sputtering technology, allowing for efficient and uniform film deposition. It is capable of depositing films on various substrates, including glass, silicon, and metal, with excellent adhesion and uniformity.
The single target design of this coater enables the deposition of single-layer films, as well as the sequential deposition of multiple layers for complex film structures. With its adjustable sputtering power and deposition time, it offers flexibility in achieving desired film thickness and properties.
Equipped with a reliable vacuum system, this coater can achieve high vacuum levels, ensuring a contamination-free environment for the coating process. The stainless steel chamber provides excellent resistance to corrosion and ensures long-lasting performance.
The user-friendly interface and intuitive control panel make operation simple and convenient. The coater is equipped with advanced safety features, including overcurrent protection and automatic power-off, ensuring the safety of both the user and the equipment.
Whether in research laboratories or industrial settings, this Single Target DC Magnetron Sputtering Coater with High Vacuum Stainless Steel Chamber is an ideal choice for precise and reliable thin film deposition. Its versatility and robust construction make it suitable for a wide range of applications, including materials science, electronics, optics, and more.
Technical parameters of single target magnetron sputtering coater:
Single target DC magnetron sputtering coating instrument | ||
Sample stage | Dimensions | φ185mm |
Heating range | Room temperature~500℃ | |
Adjustable speed | 1-20rpm adjustable | |
magnetic control target gun | Target plane | Circular plane target |
Sputtering vacuum | 10Pa~0.2Pa | |
Target diameter | 50~50.8mm | |
Target thickness | 2~5mm | |
Insulation voltage | >2000V | |
Cable specifications | SL-16 | |
Target head temperature | ≦65℃ | |
real null Cavity body | Inner wall treatment | Electrolytic polishing |
Cavity size | φ300mm × 300mm | |
Cavity material | 304 stainless steel | |
Observation window | Quartz window, diameter φ100mm | |
Open method | Top opening, cylinder auxiliary support | |
gas body control system | Flow control | Mass flow meter, range 0~200SCCM argon gas |
Control valve type | Solenoid valve | |
Control valve static state | Normally closed | |
Measuring linearity | ±1.5%F.S | |
Measurement repeatability | ±0.2%F.S | |
Measuring response time | ≤8 second(T95) | |
Working pressure range | 0.3MPa | |
Valve body pressure | 3MPa | |
Working temperature | (5~45)℃ | |
Body material | Stainless steel 316L | |
Valve body leakage rate | 1×10-8Pa.m3/s | |
Pipe joints | 1/4″Compression fitting | |
Input and output signal | 0~5V | |
Power supply | ±15V(±5%)(+15V 50mA, -15V 200mA) | |
Overall dimensions mm | 130 (width) × 102 (height) × 28 (thickness) | |
Communication Interface | RS485 MODBUS protocol | |
DC power supply | Power | 500W |
Output voltage | 0~600V | |
Timing length | 65000 second | |
Start Time | 1~10 second | |
Film thickness measurement | Power requirements | DC:5V(±10%) Maximum current 400mA |
Resolution | ±0.03Hz(5-6MHz),0.0136Å / Measurement (aluminum) | |
Measurement accuracy | ±0.5% thickness + 1 count | |
Measurement period | 100mS~1S/time (can be set) | |
Measuring range | 500,000 Å (aluminum) | |
Crystal frequency | 6MHz | |
Communication Interface | RS-232/485 serial interface | |
Display digits | 8-digit LED display | |
Molecular pump | Molecular pump pumping speed | 80L/S |
Rated speed | 65000rpm | |
Vibration value | ≦0.1um | |
Start Time | ≦4.5min | |
Downtime | <7min | |
Cooling method | Air-cooled | |
Cooling water temperature | ≦37℃ | |
Cooling water flow rate | 1L/min | |
Installation direction | Vertical ±5° | |
Suction port | 150CF | |
Exhaust connection | KF40 | |
Fore pump | Pumping rate | 1.1L/S(VRD-4) |
Ultimate vacuum | 5×10-2Pa | |
Power supply | AC:220V/50Hz | |
Power | 400W | |
Noise | ≦56db | |
Suction port | KF40 | |
Exhaust connection | KF25 | |
Release valve | Pneumatic and electronically controlled air release valve is installed on the vacuum chamber | |
The ultimate vacuum of the whole machine | ≦5×10-4Pa | |
Vacuum chamber boost rate | ≦2.5Pa/h | |
Software system | 1 set of monitoring and management software | |
Test target | 2 copper targets with a diameter of 2 inches and a thickness of 3 mm |