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TN-PLZ180-II-DC-Q
TN
The Plasma Sputtering Coater is a cutting-edge piece of equipment that is essential for depositing thin films of metals, alloys, oxides, nitrides, and other materials onto a variety of substrates. This advanced technology is commonly used in industries such as semiconductor manufacturing, optics, and electronics.
This coater utilizes a plasma sputtering process, which involves bombarding a target material with high-energy ions to release atoms that are then deposited onto the substrate. This results in a uniform and high-quality thin film coating that is essential for various applications.
The Plasma Sputtering Coater is highly versatile and can be used with a wide range of materials and substrates, including silicon wafers, glass, and ceramics. It offers precise control over the deposition process, allowing for customization of film thickness, composition, and structure.
With its advanced features and capabilities, the Plasma Sputtering Coater is a valuable tool for researchers, engineers, and manufacturers looking to create high-performance thin film coatings for a variety of applications. Its reliability, efficiency, and precision make it an indispensable asset in the field of materials science and technology.
Item | Detail |
Product model | TN-PLZ180-II-DC-Q |
Sample stage | Diameter φ60mm, can automatically switch between two target positions |
DC sputtering head | 2"x1 |
Chamber material | High purity quartz |
Chamber size | φ180mm x 150mm |
Vacuum pump | Rotary vane pump |
Ultimate vacuum | 1.0E-1Pa |
Vacuum interface | KF16 vacuum flange |
Gas inlet | φ 6.35 ferrule connector |
Power supply | AC 220V 50Hz |
Total power | 1.5KW/2KW (rotating heating) |
The Plasma Sputtering Coater is a cutting-edge piece of equipment that is essential for depositing thin films of metals, alloys, oxides, nitrides, and other materials onto a variety of substrates. This advanced technology is commonly used in industries such as semiconductor manufacturing, optics, and electronics.
This coater utilizes a plasma sputtering process, which involves bombarding a target material with high-energy ions to release atoms that are then deposited onto the substrate. This results in a uniform and high-quality thin film coating that is essential for various applications.
The Plasma Sputtering Coater is highly versatile and can be used with a wide range of materials and substrates, including silicon wafers, glass, and ceramics. It offers precise control over the deposition process, allowing for customization of film thickness, composition, and structure.
With its advanced features and capabilities, the Plasma Sputtering Coater is a valuable tool for researchers, engineers, and manufacturers looking to create high-performance thin film coatings for a variety of applications. Its reliability, efficiency, and precision make it an indispensable asset in the field of materials science and technology.
Item | Detail |
Product model | TN-PLZ180-II-DC-Q |
Sample stage | Diameter φ60mm, can automatically switch between two target positions |
DC sputtering head | 2"x1 |
Chamber material | High purity quartz |
Chamber size | φ180mm x 150mm |
Vacuum pump | Rotary vane pump |
Ultimate vacuum | 1.0E-1Pa |
Vacuum interface | KF16 vacuum flange |
Gas inlet | φ 6.35 ferrule connector |
Power supply | AC 220V 50Hz |
Total power | 1.5KW/2KW (rotating heating) |
