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small lab 3 rotary target compact plasma sputter with rotary heating stage for Gold, Platinum, Indium

This type of small plasma sputtering coating machine adopts two-stage sputtering method, which is widely used for SEM sample preparation or metal coating experiment. Using low-temperature plasma sputtering process, there is no high temperature during the coating process
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  • TN-PSP180G-3TA-RSH

  • TN

small plasma sputtering coating machine provides precise and uniform coating on various materials such as Gold, Platinum, and Indium. The compact design of this machine makes it suitable for small lab spaces.


Equipped with a rotary target and a rotary heating stage, this plasma sputtering coating machine ensures efficient and even coating distribution. The two-stage sputtering method enhances the coating quality and allows for better control over the deposition process.


With its low-temperature plasma sputtering technology, this machine offers a gentle coating process, minimizing any potential damage to the substrate. This is particularly important for delicate samples or sensitive materials.


The small lab 3 rotary target compact plasma sputter is designed for SEM sample preparation and metal coating experiments. It is an essential tool for researchers and scientists in various fields such as materials science, nanotechnology, and surface analysis.


In addition to its reliable performance, this machine is user-friendly, with intuitive controls and a user-friendly interface. It is easy to operate, even for those with limited experience in plasma sputtering.


Investing in this small lab 3 rotary target compact plasma sputter with a rotary heating stage is a wise choice for laboratories and research facilities. It offers precise and uniform coating results, ensuring accurate and reproducible experiments. Its compact size and efficient design make it a valuable addition to any lab space.


Choose this plasma sputtering coating machine for your research needs and experience professional-grade coating capabilities.

Technical parameters:

Product model

TN-PSP180G-3TA-RSH

Sample   stage

Size

100mm  

Distance   from sample stage to target surface

20~35mm   height adjustable

Rotating   speed

1~20rpm   adjustable

Heating   temperature

≤500℃

Temperature   control accuracy

±1℃ PID   temperature control

Plasma   sputtering source

Quantity

2   inchesx1/2/3

Cooling   method

Water   cooling/Natural cooling

Vacuum   chamber

Chamber   size

φ180mm x   210mm    

Observation   window

Omnidirectional   visibility

Chamber   material

High   purity quartz

Open   method

Top   cover removable

Upper   and lower cover material

304   stainless steel

Pumping   port

KF16

Intake   port

1/4   inch ferrule connector

Power   configuration

Quantity

DC   power supplyx1

Output   power

Max.   150W

Sputtering   power

1200V

Max.   sputtering current

50mA

Vacuum   system

Vacuum   pump type

Dual-stage   rotary vane vacuum pump

Pumping   port

KF16

Exhaust   interface

KF16

Pumping   rate

1.1L/s(4m3/h)

Ultimate   vacuum

≥0.1Pa

Vacuum   measurement

Resistance   vacuum gauge

Others

Power   supply

AC   220V  50Hz

Total   power

1.5kW/2kW

Dimension

500mm   x 320mm x470mm

Weight

30kg



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