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TN-PSP180G-3TA-RS
TN
ering technology, it ensures a uniform and high-quality thin film coating. The machine is equipped with a water chiller to maintain stable temperature during the coating process, ensuring consistent and accurate results.
With its compact design, this rotary target plasma sputtering coater machine is perfect for laboratories or research institutions with limited space. It is easy to operate, thanks to its user-friendly interface and intuitive controls. The two-stage sputtering method allows for precise control of the coating thickness, making it suitable for various applications.
The machine is capable of coating a wide range of materials, including metals, ceramics, and polymers. It can be used for SEM sample preparation, metal coating experiments, or any other thin film coating applications. The low-temperature plasma sputtering technology ensures minimal damage to the substrate and excellent adhesion of the coating.
With its high efficiency and reliability, this plasma sputtering coater machine is an essential tool for any laboratory or research facility. It offers precise and consistent results, helping researchers and scientists achieve their desired thin film coatings with ease. Invest in this professional-grade coater machine and enhance your research capabilities today.
Technical parameters:
Product model | TN-PSP180G-3TA-RS | |
Sample stage | Size | 100mm |
Distance from sample stage to target surface | 20~35mm height adjustable | |
Rotating speed | 1~20rpm adjustable | |
Heating temperature | ≤500℃ | |
Temperature control accuracy | ±1℃ PID temperature control | |
Plasma sputtering source | Quantity | 2 inchesx1/2/3 |
Cooling method | Water cooling/Natural cooling | |
Vacuum chamber | Chamber size | φ180mm x 210mm |
Observation window | Omnidirectional visibility | |
Chamber material | High purity quartz | |
Open method | Top cover removable | |
Upper and lower cover material | 304 stainless steel | |
Pumping port | KF16 | |
Intake port | 1/4 inch ferrule connector | |
Power configuration | Quantity | DC power supplyx1 |
Output power | Max. 150W | |
Sputtering power | 1200V | |
Max. sputtering current | 50mA | |
Vacuum system | Vacuum pump type | Dual-stage rotary vane vacuum pump |
Pumping port | KF16 | |
Exhaust interface | KF16 | |
Pumping rate | 1.1L/s（4m3/h） | |
Ultimate vacuum | ≥0.1Pa | |
Vacuum measurement | Resistance vacuum gauge | |
Others | Power supply | AC 220V 50Hz |
Total power | 1.5kW/2kW | |
Dimension | 500mm x 320mm x470mm | |
Weight | 30kg | |
ering technology, it ensures a uniform and high-quality thin film coating. The machine is equipped with a water chiller to maintain stable temperature during the coating process, ensuring consistent and accurate results.
With its compact design, this rotary target plasma sputtering coater machine is perfect for laboratories or research institutions with limited space. It is easy to operate, thanks to its user-friendly interface and intuitive controls. The two-stage sputtering method allows for precise control of the coating thickness, making it suitable for various applications.
The machine is capable of coating a wide range of materials, including metals, ceramics, and polymers. It can be used for SEM sample preparation, metal coating experiments, or any other thin film coating applications. The low-temperature plasma sputtering technology ensures minimal damage to the substrate and excellent adhesion of the coating.
With its high efficiency and reliability, this plasma sputtering coater machine is an essential tool for any laboratory or research facility. It offers precise and consistent results, helping researchers and scientists achieve their desired thin film coatings with ease. Invest in this professional-grade coater machine and enhance your research capabilities today.
Technical parameters:
Product model | TN-PSP180G-3TA-RS | |
Sample stage | Size | 100mm |
Distance from sample stage to target surface | 20~35mm height adjustable | |
Rotating speed | 1~20rpm adjustable | |
Heating temperature | ≤500℃ | |
Temperature control accuracy | ±1℃ PID temperature control | |
Plasma sputtering source | Quantity | 2 inchesx1/2/3 |
Cooling method | Water cooling/Natural cooling | |
Vacuum chamber | Chamber size | φ180mm x 210mm |
Observation window | Omnidirectional visibility | |
Chamber material | High purity quartz | |
Open method | Top cover removable | |
Upper and lower cover material | 304 stainless steel | |
Pumping port | KF16 | |
Intake port | 1/4 inch ferrule connector | |
Power configuration | Quantity | DC power supplyx1 |
Output power | Max. 150W | |
Sputtering power | 1200V | |
Max. sputtering current | 50mA | |
Vacuum system | Vacuum pump type | Dual-stage rotary vane vacuum pump |
Pumping port | KF16 | |
Exhaust interface | KF16 | |
Pumping rate | 1.1L/s（4m3/h） | |
Ultimate vacuum | ≥0.1Pa | |
Vacuum measurement | Resistance vacuum gauge | |
Others | Power supply | AC 220V 50Hz |
Total power | 1.5kW/2kW | |
Dimension | 500mm x 320mm x470mm | |
Weight | 30kg | |
