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Double Target Plasma Sputter Coater with Vacuum Pump for Gold, Platinum, Indium And Silver Coatings

This type of small plasma sputtering coating machine adopts two-stage sputtering method, which is widely used for SEM sample preparation or metal coating experiment. Using low-temperature plasma sputtering process, there is no high temperature during the coating process
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  • TN-PSP180G-2TA-R

  • TN

double target plasma sputter coater is able to provide high-quality gold, platinum, indium, and silver coatings on various substrates.


The Double Target Plasma Sputter Coater is designed to meet the demanding requirements of SEM sample preparation and metal coating experiments. With its advanced technology and precise control, this coater ensures consistent and uniform coatings, allowing for accurate analysis and observation under the scanning electron microscope.


Equipped with a vacuum pump, this coater creates a low-pressure environment necessary for the plasma sputtering process. The double target configuration allows for simultaneous coating with different materials, increasing productivity and versatility. Whether you need gold, platinum, indium, or silver coatings, this coater delivers exceptional results.


The low-temperature plasma sputtering process used by this coater offers several advantages. It minimizes the risk of thermal damage to delicate samples, ensuring their integrity throughout the coating process. Additionally, the precise control of deposition parameters allows for fine-tuning of coating thickness, ensuring optimal results for your specific application.


With its professional-grade performance and user-friendly interface, the Double Target Plasma Sputter Coater is the ideal choice for researchers, scientists, and technicians in the field of material science, nanotechnology, and electronics. Its reliability, efficiency, and versatility make it an essential tool for any laboratory or research facility.


Invest in the Double Target Plasma Sputter Coater with Vacuum Pump for Gold, Platinum, Indium, and Silver Coatings, and elevate your sample preparation and metal coating experiments to new heights of precision and quality.

Technical parameters:

Product model

TN-PSP180G-2TA-R

Sample   stage

Size

100mm  

Distance   from sample stage to target surface

20~35mm   height adjustable

Rotating   speed

1~20rpm   adjustable

Heating   temperature

≤500℃

Temperature   control accuracy

±1℃ PID   temperature control

Plasma   sputtering source

Quantity

2   inchesx1/2/3

Cooling   method

Water   cooling/Natural cooling

Vacuum   chamber

Chamber   size

φ180mm x   210mm    

Observation   window

Omnidirectional   visibility

Chamber   material

High   purity quartz

Open   method

Top   cover removable

Upper   and lower cover material

304   stainless steel

Pumping   port

KF16

Intake   port

1/4   inch ferrule connector

Power   configuration

Quantity

DC   power supplyx1

Output   power

Max.   150W

Sputtering   power

1200V

Max.   sputtering current

50mA

Vacuum   system

Vacuum   pump type

Dual-stage   rotary vane vacuum pump

Pumping   port

KF16

Exhaust   interface

KF16

Pumping   rate

1.1L/s(4m3/h)

Ultimate   vacuum

≥0.1Pa

Vacuum   measurement

Resistance   vacuum gauge

Others

Power   supply

AC   220V  50Hz

Total   power

1.5kW/2kW

Dimension

500mm   x 320mm x470mm

Weight

30kg



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