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Introducing our Copper (Cu) Sputtering Targets - the ultimate solution for your sputtering and deposition needs. Crafted with utmost precision and quality, these sputtering targets are designed to deliver exceptional performance in various applications.
Our Copper (Cu) Sputtering Targets are meticulously manufactured using advanced techniques, ensuring a consistent and reliable product. These targets are specifically engineered to meet the demands of industries such as electronics, semiconductor, and thin film technology.
With our Copper (Cu) Sputtering Targets, you can achieve superior film quality and deposition efficiency. These targets exhibit excellent thermal conductivity, allowing for efficient heat dissipation during the sputtering process. The high purity of our Copper (Cu) Sputtering Targets guarantees minimal impurities, resulting in clean and defect-free films.
In addition to sputtering targets, we also offer a wide range of evaporation sources and other deposition materials to cater to your specific requirements. Our comprehensive selection ensures that you have access to all the necessary materials for your deposition processes.
Choose our Copper (Cu) Sputtering Targets for their exceptional quality, reliability, and performance. Trust in our expertise and experience to enhance your thin film deposition processes. Invest in our products and unlock the potential for cutting-edge advancements in your industry.
Experience the precision and professionalism of our Copper (Cu) Sputtering Targets. Contact us today to learn more about our products and how they can revolutionize your sputtering and deposition processes.
Copper (Cu) Specifications：
Material Type | Copper |
Symbol | Cu |
Atomic Weight | 63.546 |
Atomic Number | 29 |
Color/Appearance | Copper, Metallic |
Thermal Conductivity | 400 W/m.K |
Melting Point (°C) | 1,083 |
Coefficient of Thermal Expansion | 16.5 x 10-6/K |
Theoretical Density (g/cc) | 8.92 |
Z Ratio | 0.437 |
Sputter | DC |
Max Power Density (Watts/Square Inch) | 200* |
Type of Bond | Indium, Elastomer |
Comments | Adhesion poor. Use interlayer (Cr). Evaporates using any source material. |
Introducing our Copper (Cu) Sputtering Targets - the ultimate solution for your sputtering and deposition needs. Crafted with utmost precision and quality, these sputtering targets are designed to deliver exceptional performance in various applications.
Our Copper (Cu) Sputtering Targets are meticulously manufactured using advanced techniques, ensuring a consistent and reliable product. These targets are specifically engineered to meet the demands of industries such as electronics, semiconductor, and thin film technology.
With our Copper (Cu) Sputtering Targets, you can achieve superior film quality and deposition efficiency. These targets exhibit excellent thermal conductivity, allowing for efficient heat dissipation during the sputtering process. The high purity of our Copper (Cu) Sputtering Targets guarantees minimal impurities, resulting in clean and defect-free films.
In addition to sputtering targets, we also offer a wide range of evaporation sources and other deposition materials to cater to your specific requirements. Our comprehensive selection ensures that you have access to all the necessary materials for your deposition processes.
Choose our Copper (Cu) Sputtering Targets for their exceptional quality, reliability, and performance. Trust in our expertise and experience to enhance your thin film deposition processes. Invest in our products and unlock the potential for cutting-edge advancements in your industry.
Experience the precision and professionalism of our Copper (Cu) Sputtering Targets. Contact us today to learn more about our products and how they can revolutionize your sputtering and deposition processes.
Copper (Cu) Specifications：
Material Type | Copper |
Symbol | Cu |
Atomic Weight | 63.546 |
Atomic Number | 29 |
Color/Appearance | Copper, Metallic |
Thermal Conductivity | 400 W/m.K |
Melting Point (°C) | 1,083 |
Coefficient of Thermal Expansion | 16.5 x 10-6/K |
Theoretical Density (g/cc) | 8.92 |
Z Ratio | 0.437 |
Sputter | DC |
Max Power Density (Watts/Square Inch) | 200* |
Type of Bond | Indium, Elastomer |
Comments | Adhesion poor. Use interlayer (Cr). Evaporates using any source material. |
