Aluminum Silicon Copper (Al,Si,Cu, 98/1/1 Wt%) Sputtering Targets

Introducing our high-quality Aluminum Silicon Copper (Al,Si,Cu, 98/1/1 wt%) Sputtering Targets, designed to meet the demanding needs of various deposition processes.

Our sputtering targets are manufactured using advanced techniques and state-of-the-art technology, ensuring exceptional performance and reliability. With a composition of 98% Aluminum, 1% Silicon, and 1% Copper by weight, these targets are specifically engineered to deliver precise and consistent deposition results.

These targets are ideal for sputtering applications, where material is ejected from the target surface and deposited onto a substrate, creating thin films with exceptional uniformity and adherence. Whether you're working in the semiconductor, optical coating, or thin film solar cell industry, our Aluminum Silicon Copper sputtering targets will provide the high-quality deposition materials you need.

In addition to sputtering targets, we also offer a wide range of evaporation sources and other deposition materials to cater to your specific requirements. Our comprehensive selection ensures that you can find the perfect materials to achieve the desired thin film characteristics and performance.

When it comes to deposition materials, precision and consistency are paramount. Trust our Aluminum Silicon Copper (Al,Si,Cu, 98/1/1 wt%) Sputtering Targets to deliver exceptional results, enabling you to achieve the highest levels of performance and reliability in your deposition processes.

Choose our professional-grade sputtering targets, evaporation sources, and deposition materials to elevate your thin film deposition capabilities to new heights. Contact us today to discuss your specific needs and discover how our products can enhance your deposition processes.