Availability: | |
---|---|
Quantity: | |
TN
Introducing our Lead (Pb) Sputtering Targets - the epitome of excellence in the field of thin film deposition. Designed to meet the demanding requirements of various industries, our sputtering targets, evaporation sources, and other deposition materials offer unparalleled performance and reliability.
Crafted with utmost precision and utilizing the finest quality materials, our Lead (Pb) Sputtering Targets are engineered to deliver exceptional results in thin film deposition processes. These targets are meticulously manufactured using advanced techniques, ensuring uniformity, high purity, and superior density.
With a professional tone, we take pride in offering a comprehensive range of sputtering targets, evaporation sources, and other deposition materials to cater to diverse applications. Our Lead (Pb) Sputtering Targets are specifically designed to provide excellent adhesion, uniform film thickness, and exceptional film quality.
Whether you are involved in semiconductor manufacturing, optical coating, or research and development, our Lead (Pb) Sputtering Targets are your ideal choice. Backed by years of experience and a commitment to innovation, our products are trusted by leading industry professionals worldwide.
Invest in our Lead (Pb) Sputtering Targets and experience the difference in performance and reliability. With our dedication to quality and customer satisfaction, we strive to exceed your expectations and provide you with the finest deposition materials available in the market.
Choose excellence, choose our Lead (Pb) Sputtering Targets for your thin film deposition needs. Contact us today to discuss your specific requirements and let us help you achieve remarkable results in your deposition processes.
Lead (Pb) Specifications:
Material Type | Lead |
Symbol | Pb |
Atomic Weight | 207.2 |
Atomic Number | 82 |
Color/Appearance | Bluish White, Metallic |
Thermal Conductivity | 35 W/m.K |
Melting Point (°C) | 328 |
Coefficient of Thermal Expansion | 28.9 x 10-6/K |
Theoretical Density (g/cc) | 11.34 |
Z Ratio | 1.13 |
Sputter | DC |
Max Power Density (Watts/Square Inch) | 10* |
Introducing our Lead (Pb) Sputtering Targets - the epitome of excellence in the field of thin film deposition. Designed to meet the demanding requirements of various industries, our sputtering targets, evaporation sources, and other deposition materials offer unparalleled performance and reliability.
Crafted with utmost precision and utilizing the finest quality materials, our Lead (Pb) Sputtering Targets are engineered to deliver exceptional results in thin film deposition processes. These targets are meticulously manufactured using advanced techniques, ensuring uniformity, high purity, and superior density.
With a professional tone, we take pride in offering a comprehensive range of sputtering targets, evaporation sources, and other deposition materials to cater to diverse applications. Our Lead (Pb) Sputtering Targets are specifically designed to provide excellent adhesion, uniform film thickness, and exceptional film quality.
Whether you are involved in semiconductor manufacturing, optical coating, or research and development, our Lead (Pb) Sputtering Targets are your ideal choice. Backed by years of experience and a commitment to innovation, our products are trusted by leading industry professionals worldwide.
Invest in our Lead (Pb) Sputtering Targets and experience the difference in performance and reliability. With our dedication to quality and customer satisfaction, we strive to exceed your expectations and provide you with the finest deposition materials available in the market.
Choose excellence, choose our Lead (Pb) Sputtering Targets for your thin film deposition needs. Contact us today to discuss your specific requirements and let us help you achieve remarkable results in your deposition processes.
Lead (Pb) Specifications:
Material Type | Lead |
Symbol | Pb |
Atomic Weight | 207.2 |
Atomic Number | 82 |
Color/Appearance | Bluish White, Metallic |
Thermal Conductivity | 35 W/m.K |
Melting Point (°C) | 328 |
Coefficient of Thermal Expansion | 28.9 x 10-6/K |
Theoretical Density (g/cc) | 11.34 |
Z Ratio | 1.13 |
Sputter | DC |
Max Power Density (Watts/Square Inch) | 10* |