| Quantity: | |
|---|---|
TN
materials for use in physical vapor deposition (PVD) processes. Made from high purity Nickel Iron (NiFe) materials, these sputtering targets are designed to provide exceptional performance and reliability in various thin film deposition applications.
Our Nickel Iron (NiFe) sputtering targets are meticulously engineered to meet the stringent requirements of advanced semiconductor, optical coating, and magnetic storage industries. With their excellent thermal stability, uniform composition, and low defect density, these targets ensure consistent film deposition, resulting in high-quality thin films with superior adhesion and film density.
These sputtering targets are compatible with a wide range of deposition systems and can be used for both DC and RF sputtering techniques. Their exceptional purity and controlled grain structure enable precise control over film properties, such as thickness, composition, and morphology. This makes them ideal for applications in magnetoresistive random-access memory (MRAM), giant magnetoresistance (GMR) devices, and other magnetic thin film technologies.
In addition to sputtering targets, we also offer a comprehensive range of evaporation sources and other deposition materials. These include crucibles, boats, and foils, all designed to facilitate the deposition of high-quality thin films with excellent uniformity and reproducibility.
With our Nickel Iron (NiFe) sputtering targets and deposition materials, you can achieve precise control over film properties, improve device performance, and enhance the overall efficiency of your thin film deposition processes. Trust our high-quality products to provide you with the reliability and performance you need for your advanced thin film applications.
Nickel Iron (Ni/Fe) Specifications：
Material Type | Nickel/Iron † |
Symbol | Ni/Fe |
Theoretical Density (g/cc) | 8.7 |
Ferromagnetic | Magnetic Material |
Z Ratio | **1.00 |
materials for use in physical vapor deposition (PVD) processes. Made from high purity Nickel Iron (NiFe) materials, these sputtering targets are designed to provide exceptional performance and reliability in various thin film deposition applications.
Our Nickel Iron (NiFe) sputtering targets are meticulously engineered to meet the stringent requirements of advanced semiconductor, optical coating, and magnetic storage industries. With their excellent thermal stability, uniform composition, and low defect density, these targets ensure consistent film deposition, resulting in high-quality thin films with superior adhesion and film density.
These sputtering targets are compatible with a wide range of deposition systems and can be used for both DC and RF sputtering techniques. Their exceptional purity and controlled grain structure enable precise control over film properties, such as thickness, composition, and morphology. This makes them ideal for applications in magnetoresistive random-access memory (MRAM), giant magnetoresistance (GMR) devices, and other magnetic thin film technologies.
In addition to sputtering targets, we also offer a comprehensive range of evaporation sources and other deposition materials. These include crucibles, boats, and foils, all designed to facilitate the deposition of high-quality thin films with excellent uniformity and reproducibility.
With our Nickel Iron (NiFe) sputtering targets and deposition materials, you can achieve precise control over film properties, improve device performance, and enhance the overall efficiency of your thin film deposition processes. Trust our high-quality products to provide you with the reliability and performance you need for your advanced thin film applications.
Nickel Iron (Ni/Fe) Specifications：
Material Type | Nickel/Iron † |
Symbol | Ni/Fe |
Theoretical Density (g/cc) | 8.7 |
Ferromagnetic | Magnetic Material |
Z Ratio | **1.00 |
